HIGH QUALITY PLATING SERVICES

OVERVIEW

UNITECH INDUSTRIES offers both rack and barrel plating.

Plating on Steel,Stainless Steel,Aluminum and its alloys,Copper and its alloys,Nickel and its alloys, including inconel 750 , Ceramics and other substrates.

ADDITIONAL PROCESSES

• Masking and Selective plating
• Vibratory finishing
• Glass bead blasting
• De-greasing
• Baking
• Hydrogen embrittlement relief treatment
• Printed circuit board repair

ELECTROLESS PLATING

For more information about plating options, please click on the name of the list item below.

• ELECTROLESS NICKEL

  specifications + properties

  ASTM B733 ,MIL-C-26074E , SAE AMS 2404E & 2405, Rockwell 580-0766 , Rockwell 580-5296

  Electroless Nickel provides a deposit that follows all contours of the substrate exactly,without building up at the edges and corners. A sharp edge receives the same thickness of deposit as a blind hole.

  The following table compares some but not all the deposit properties of electrolytic vs. electroless nickel.

  • Properties
  • Electroless
  • Electrolytic

  
  

  • Composition
  • Avg. 92% Ni/ 8% P
  • 99 + % Ni

  • Thickness uniformity
  • +-10%
  • varies

  • Melting point
  • 890 Deg.C
  • 1455 Deg.C

  • Hardness, as plated
  • 500-600 VHN
  • 150-400 VHN

  • Heat hardening
  • To 1000 VHN
  • No effect

  • Wear resistance
  • Excellent
  • Fair

  • Elongation
  • 2%
  • 6-30 %

  • Corrosion resistance
  • Very good (few pores)
  • Good (porous)

  
  

  Low phos.

  1-4 % w/w, Hardness as plated 60-62 Rc, Magnetic. Compressively stressed hard EN deposit with excellent corrosion resistance in alkaline environment.

  Medium phos.

  6-9 % wt., Hardness 47-54 Rc,Slightly magnetic as plated. Long life on aluminum. low friction

  High phos.

  10.5-13 % w/w. Hardness 46-47 Rc, Non magnetic as plated. Non magnetic 290 deg.C/1 hr.

• BORON ELECTROLESS NICKEL

  specifications + properties

  Is designed to produce semi-bright, uniform nickel alloy deposits containing a maximum of 0.5 % boron. These deposits have low internal stress and are characterized by resistance to high temperatures, good weldability, brazeability, solderability and high hardness which improves their resistance to wear.

• SULFAMATE NICKEL

  specifications + properties

  QQ-N-290,ASTM B-689, AMS 2403,ISO 1458

  Semi-bright low stress, ductile; is especially suited for electronic applications and for Printed Circuits requiring surface mount applications.

• WOOD'S NICKEL STRIKE

  specifications + properties

  Good undercoat, hard, corrosion resistant.

• TIN-NICKEL

  specifications + properties

  ISO 2179,ASTM B-605

  65/35 Tin-Nickel, corrosion protection for most fabricated articles of iron, steel, zinc base alloys, copper and copper alloys.

• GOLD

  specifications + properties

  Mil-G-45204 ,Type 1,11&111 ,Gr.A,B and C. ASTM B488-95,AMS 2422,AMS 2425

  Excellent corrosion resistance, stable electrical contact resistance, wear resistance, heat resistance and reflectivity. Low stress.

• RHODIUM

  specifications + properties

  ASTM B 634,MIL-R-46085, ASTM B634-88R99

  Excellent corrosion resistance. Stable electrical contact resistance, wear resistance, heat resistance and reflectivity. Lead free.

• SILVER

  specifications + properties

  ASTM B-700,Type 1,Type 2, Gr.A (matt), Gr.B (bright),QQ-S-365

  Corrosion resistance. Excellent for solderability. Very conductive, ductile deposit.

• TIN

  specifications + properties

  ASTM B-545,MIL-T-10728,ISO 2093,AMS 2408

  Long shelf life. Excellent solderability. Decorative.

• IMMERSION GOLD

  specifications + properties

  IPC 4552

  Excellent for printed circuit board applications.

• IMMERSION SILVER

  specifications + properties

  For printed circuit applications.

• ELECTROLESS PALLADIUM

  specifications + properties

  Excellent for printed circuit board applications.